Samoa Digital Library
Balancing Thermal and Electrical Packaging Requirements for GaN Microwave and Millimeter-Wave High Power Amplifier Modules
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| dc.contributor.author | Rick Sturdivant1, Astacian Bogdon1, Edwin K. P. Chong2 | |
| dc.date.accessioned | 2021-12-11T10:01:50Z | |
| dc.date.available | 2021-12-11T10:01:50Z | |
| dc.date.issued | 2017 | |
| dc.identifier.uri | ${sadil.baseUrl}/handle/123456789/1882 | |
| dc.title | Balancing Thermal and Electrical Packaging Requirements for GaN Microwave and Millimeter-Wave High Power Amplifier Modules | |
| dc.type | Journal |
